Lam Research Corp. Introduces Breakthrough Deposition Technique to Enable Next-Generation MEMS for 5G and Beyond
Lam Research Corp. Introduces Breakthrough Deposition Technique to Enable Next-Generation MEMS for 5G and Beyond
Mar 26, 2024
marketscreener.com
Deposition is essential to the fabrication process and varies depending on the material used and purpose it serves on a chip. While many methods exist, the five most common are: ◾ Chemical vapor deposition (CVD) ◾ Electrochemical deposition (ECD) ◾ Physical vapor deposition (PVD) ◾ Ultraviolet thermal processing (UVTP) ◾ Pulsed laser deposition (PLD) After more than four decades in the market, we remain one of the top suppliers of deposition technology and solutions. Explore our extensive produc
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Deposition is essential to the fabrication process and varies depending on the material used and purpose it serves on a chip. While many methods exist, the five most common are: ◾ Chemical vapor deposition (CVD) ◾ Electrochemical deposition (ECD) ◾ Physical vapor deposition (PVD) ◾ Ultraviolet thermal processing (UVTP) ◾ Pulsed laser deposition (PLD) After more than four decades in the market, we remain one of the top suppliers of deposition technology and solutions. Explore our extensive produc
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We have been a leader in the deposition market for nearly 45 years, ranking among the top suppliers worldwide for deposition tools. Our tools include VECTOR® for plasma-enhanced CVD, Striker® for atomic layer deposition, and ALTUS® for metal ALD/CVD, among others. Dive deeper via the blog. https://bit.ly/4078QSi | Lam Research Corporation
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We have been a leader in the deposition market for nearly 45 years, ranking among the top suppliers worldwide for deposition tools. Our tools include VECTOR® for plasma-enhanced CVD, Striker® for atomic layer deposition, and ALTUS® for metal ALD/CVD, among others. Dive deeper via the blog. https://bit.ly/4078QSi | Lam Research Corporation
534 viewsOct 15, 2024
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What is metallization? 🔍 The deposition of metal film, such as molybdenum (Mo), which connects copper interconnects in integrated circuits. Explore how we revolutionize semiconductor metallization using the atomic layer deposition capabilities of ALTUS® Halo to deposit thin Mo films in an integrated circuit. https://bit.ly/4kFN7rH | Lam Research Corporation
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What is metallization? 🔍 The deposition of metal film, such as molybdenum (Mo), which connects copper interconnects in integrated circuits. Explore how we revolutionize semiconductor metallization using the atomic layer deposition capabilities of ALTUS® Halo to deposit thin Mo films in an integrated circuit. https://bit.ly/4kFN7rH | Lam Research Corporation
289 views11 months ago
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After 20 years of high-volume, tungsten-based atomic layer deposition, we’re equipping chipmakers with solutions set to power the future of AI. Learn how ALTUS® Halo technology helps enable molybdenum-based metallization for the development of next-generation DRAM and foundry logic devices. https://bit.ly/3FRnipp | Lam Research Corporation
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After 20 years of high-volume, tungsten-based atomic layer deposition, we’re equipping chipmakers with solutions set to power the future of AI. Learn how ALTUS® Halo technology helps enable molybdenum-based metallization for the development of next-generation DRAM and foundry logic devices. https://bit.ly/3FRnipp | Lam Research Corporation
1.4K viewsApr 8, 2025
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Lam Research Corp. Releases VECTOR ALD Oxide System
Lam Research Corp. Releases VECTOR ALD Oxide System
Jul 20, 2015
marketscreener.com
As 3D NAND technology advances, the demand for greater deposition and etch intensity grows. Adding more memory layers requires not only innovative engineering but also precise material deposition and enhanced etch techniques. See how applying stress-compensating materials and leveraging molybdenum for improved conductivity ensure reliable scaling and more in the video below. | Lam Research Corporation
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As 3D NAND technology advances, the demand for greater deposition and etch intensity grows. Adding more memory layers requires not only innovative engineering but also precise material deposition and enhanced etch techniques. See how applying stress-compensating materials and leveraging molybdenum for improved conductivity ensure reliable scaling and more in the video below. | Lam Research Corporation
562 viewsMar 25, 2025
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In case you missed it — we launched VECTOR® TEOS 3D! This breakthrough deposition tool is engineered to address the advanced packaging demands of next-generation AI and high-performance computing (HPC) applications. If this is your first time hearing about VECTOR® TEOS 3D, here’s a quick rundown. ⬇️ 📖 Blog Post: https://newsroom.lamresearch.com/everything-you-need-to-know-about-vector-teos-3d 🗞️ Press Release: https://investor.lamresearch.com/2025-09-09-Lam-Research-Introduces-VECTOR-R-TEOS-3D
628 views4 months ago
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As chips continue to shrink in size, the complexity and cost of semiconductor manufacturing increases. Today, we launched Coronus DX, the industry’s first bevel deposition solution optimized to address key challenges in advanced semiconductor manufacturing. Read for more. https://bit.ly/46b4OJg | Lam Research Corporation
1.1K viewsJun 20, 2023
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Our cryogenic dielectric etch technology—Lam Cryo 3.0—delivers enhanced etch rates, vertical high aspect ratio (HAR) profiles, and more. Learn how Lam Cryo 3.0 is optimized to manufacture next-generation 3D NAND devices with 400 layers and beyond from Group VP and GM of Etch Product Group, Harmeet Singh. https://bit.ly/3yCkBVv | Lam Research Corporation
451 viewsSep 19, 2024
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As semiconductor technology continues to advance, precise patterning becomes increasingly important, and our Aether® dry resist technology plays a key role in this evolution. Aether integrates with EUV (extreme ultraviolet) lithography to overcome pattern resolution challenges and supports the production of smaller, more efficient chips. Learn how Aether helps the industry scale to meet future demands. https://bit.ly/4gMXYh4 | Lam Research Corporation
306 viewsFeb 18, 2025
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As the industry marches toward 1,000-layer 3D NAND, new challenges emerge — slower etch rates, vertical profile issues, and greater scaling complexity. Through innovations in etch and deposition technology, like Lam Cryo™ 3.0, we overcome these obstacles and drive memory density to new heights. Read more in Counterpoint Technology Market Research's whitepaper. https://bit.ly/3WDsTVN | Lam Research Corporation
378 viewsJan 28, 2025
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Our cutting-edge advanced packaging technologies make High Bandwidth Memory (HBM) a reality for #GenAI devices. Discover why solutions like 2.5D and 3D integration are critical for enabling the third generation of HBM and providing high-speed access to vast data sets for #AI training. https://bit.ly/47ekrAC | Lam Research Corporation
688 viewsDec 17, 2024
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Building chips this small takes some serious patterning power.⚡ Our advanced patterning tools help print features a few atoms wide with precision that makes “close enough” obsolete. Read our Semi 101 blog post for a breakdown. https://bit.ly/4oVFAYI | Lam Research Corporation
906 views5 months ago
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In 1987, our Concept One® PECVD system hit the semiconductor scene, igniting our tungsten deposition journey and raising the bar for manufacturing precision. Can you guess what else happened that same year? Toshiba introduced NAND flash memory — the tech behind the storage in countless devices we rely on today. Discover more milestones in our history. https://bit.ly/3IaVwpn | Lam Research Corporation
699 views8 months ago
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Imagine a workspace where humans and robots work side by side, seamlessly enhancing productivity and safety in fabs. That is our vision with Dextro™, our collaborative robot (cobot) built for semiconductor manufacturing and equipment maintenance. Learn how our cobot helps chip makers meet surging demands for semiconductors and AI while driving ROI. https://bit.ly/3VAvJud | Lam Research Corporation
371 viewsDec 11, 2024
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What’s thinner than a strand of hair but powers your entire digital life? Layers made through deposition. It’s how chips are built: one film at a time, with precision down to the atom. Dive into our Semi 101 blog post to see how it all stacks up. https://bit.ly/4078QSi | Lam Research Corporation
686 views6 months ago
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Logic scaling packs billions more transistors into the same space, unlocking faster performance, higher efficiency, and new AI capabilities. Discover how our etch, deposition, and advanced patterning innovations make it possible. https://bit.ly/4nplc0W | Lam Research Corporation
634 views7 months ago
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Step inside of a wafer to see how our tools tackle bonding, dicing, etching, and deposition with the precision needed to shrink gaps, smooth interfaces, and strengthen every layer. The advanced packaging era is here — take a closer look. | Lam Research Corporation
623 views7 months ago
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With low resistivity and no barrier layers, molybdenum unlocks the next generation of 3D NAND, DRAM, and logic devices. Discover how our industry-leading molybdenum deposition tool, ALTUS® Halo, makes Mo-based metallization possible from Counterpoint Technology Market Research. https://bit.ly/3JYUVb5 | Lam Research Corporation
1.2K views8 months ago
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Scaling DRAM demands more than smaller features; it requires new architectures. We provide the process control and material precision to enable 3D stacking, advanced etch profiles, and atomic layer deposition of next-generation materials like molybdenum. Each step moves memory technology beyond its 2D limits and into a new dimensional era. Watch the video for more. | Lam Research Corporation
982 views3 months ago
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With ALTUS® Halo, chipmakers gain a solution designed for the next era of metallization, delivering consistent, atomic-level molybdenum deposition to support the most advanced device architectures. The video breaks it down. | Lam Research Corporation
355 views9 months ago
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Lam Research unveils two new chipmaking tools for AI chips
Feb 19, 2025
theprint.in
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What is Atomic Layer Deposition (ALD)? | Lam Research posted on the topic | LinkedIn
3 viewsMay 8, 2025
linkedin.com
"Seed layer: The thin film that starts it all" | Lam Research posted on the topic | LinkedIn
9 months ago
linkedin.com
Wire Laser Metal Deposition (w-LMD)
Dec 13, 2021
twi-global.com
10:05
AI for Lawyers: How to Prepare for Depositions Faster and Smarter | ‪@AlderTalk‬ with Mike Alder
337 views3 weeks ago
YouTubeAlderTalk
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Manufacturing Semiconductor ALD Equipment
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Deposition Training Program
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Semiconductor Wafer Processing
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