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1分鐘讓你搞懂台積電的CoWoS背後原理 目前最受矚目先進封裝技術無非台積電的CoWoS技術，CoWoS 主要把晶片堆疊再封裝於基板，形成2.5D甚至3D型態，一分鐘帶你了解背後原理！ #AI #半導體 #cowos #台積電 #摩爾定律 | Technews 科技新報
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The primary bottleneck that Intel faces with advanced packaging right now is helping with the transition for fabless customers who are looking for an alternative to CoWoS.There have been some 'recruits (ahm....)' that is helping Intel get customers, but advanced packaging is an attractive venue. It will become more appealing once 3D stacking becomes the new norm with accelerators like Feynman, and we know Foveros Direct-3D is a compelling solution.
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