Tata Electronics and the Centre for Development of Advanced Computing (C-DAC), under the Ministry of Electronics and Information Technology (MeitY), signed a Memorandum of Understanding (MoU) to ...

Arteris, Inc., a provider of system IP for semiconductor development, announced an expansion of its multi-die solution to support chiplet-based designs. The solution addresses the increasing ...

At the 2025 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, Siemens Digital Industries Software announced new collaborations with TSMC to support the foundry’s latest process ...

AMI has announced that it is bringing its expertise in industry-leading silicon firmware solutions to the Arm Total Design ecosystem, aimed at accelerating development of custom silicon on Arm Compute ...

Samsung held a tool-in ceremony for its new semiconductor research and development complex (NRD-K) at its Giheung campus, marking a significant leap into the future. About 100 guests, including those ...

Sony Semiconductor announced the upcoming release of the IMX925 stacked CMOS image sensor with back-illuminated pixel structure and global shutter. This new product offers 394 fps high-speed ...

Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass production of QLC 9th-generation ...

Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB using conventional magnetic recording (CMR), ...

SK hynix developed the industry’s first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process. The success marks the beginning of the extreme scaling to the level closer to 10nm ...

Market researcher Omdia reported the AI processors for cloud and the data center market has grown from just under $10bn in 2022 to $78bn this year (2024), and Omdia expects it will eventually reach ...

Texas Instruments announced introduction of six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack integrated ...