Sub-2nm manufacturing is blurring traditional process boundaries as shrinking dimensions and tighter margins make test, metrology, inspection, and manufacturing increasingly interdependent.

Through better manufacturing screening, DFT for systems and fleet monitors, this major scourge on data center hardware is gradually being tamed.

Kilowatt-class AI accelerators are forcing engineers to rethink what counts as adequate coverage across workload, thermal behavior, test hardware, and time.

Cost per token is causing EDA design budgets to balloon; what comes next isn’t entirely clear yet. Discussions have shifted ...

Just because a chip is deemed good doesn’t mean it will work as expected.

GPUs are 70% of installed worldwide AI compute capacity by manufacturer (see figure 1), with custom silicon accounting for 30 ...

Researchers from the National University of Singapore developed an atom-thin film of amorphous carbon designed to insulate ...

Researchers at the University of Oxford published a technical paper titled “Hardware-Managed Heterogeneous High-Bandwidth ...

As AI, post-quantum cryptography, chiplets, and custom silicon expand the attack surface, semiconductor security is shifting ...

In edge AI, the most dangerous failure may not be a system that stops working, but one that continues operating while quietly ...

Enable robust cryptographic mechanisms that remain resilient even against quantum-based computational attacks.

Researchers from University of Alberta published a technical paper titled “PPAPlace: Differentiable Cross-Stage Objectives ...