Semiconductor Engineering

Beyond Thickness: Using Picosecond Ultrasonic Technology For SiCr Process Control In BCD Devices

Improve visibility into deposition variation by combining thickness metrology with simultaneous reflectivity measurements.
Semiconductor Engineering

Beyond Conventional Ring Oscillators: Purpose-Built Process Detectors For Deeper Silicon Insight

How design-aware monitor analytics connects production measurements with device behavior and pre-silicon expectations.

Molecular surface design achieves over 100 million-fold tuning of porous liquid viscosity

Porous liquids combine permanent nanoscale cavities with fluidity, making them promising for applications like carbon dioxide ...
semiconductor-digest

ASML Begins Construction of New Eindhoven Campus

ASML Holding N.V. today marked the start of construction of its second major industrial campus in the Brainport region, the Netherlands.

DB HiTek Completes Reliability Qualification for 8-Inch 1,200 V SiC MOSFET Process

DB HiTek, South Korea's leading pure-play 8-inch foundry, announced that it has successfully completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch (200 mm) ...

GMG Announces Long Life Battery Cycling Data

Detailed price information for Graphene Manufacturing Group Ltd (GMG-X) from The Globe and Mail including charting and trades.
finance.biggo

DB HiTek Builds World's First 8-Inch SiC Foundry Turnkey Process; Mass Production Set for 2027

South Korea's DB HiTek has completed reliability verification of its 1200V SiC MOSFET process on 8-inch wafers and announced the establishment of ...
Compound Semiconductor

DB HiTek qualifies 200mm 1.2kV SiC MOSFET process

DB HiTek, a South Korean pure-play 8-inch foundry, has announced successfully completing reliability qualification for its ...