The new HUDIMM memory modules are expected to significantly reduce memory bandwidth and I/O throughput, but the change should ...
This is where small outline compression attached memory modules (SOCAMMs) fit in. Frank Ferro, group director for product ...
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced milestones from its JC-40 and JC-45 Committees for Logic and ...
Nvidia has reportedly introduced a 12GB RTX 5070 laptop GPU, addressing rising memory needs tied to AI-driven workflows. It ...
ASUS has introduced support for HUDIMM memory modules across its Intel 800 series motherboard lineup, bringing a lower-cost DDR5 option to platforms based on Z890, B860, Q870, and H810 chipsets.
SK hynix, the world's second-largest memory chipmaker, said Monday it had begun mass production of 192 GB memory modules, ...
ASUS AEMP lets users optimize mixed JEDEC DDR5 memory kits without XMP on Intel Z890 and B860 boards
Results showed a 33% improvement in CAS latency with AEMP II and III, though both are limited to Intel boards, while AMD ...
SK hynix said Monday it has begun mass production of its 192GB small outline compression attached memory module 2 (SOCAMM2), ...
SK hynix said Monday it has begun mass production of a next-generation memory module designed for AI servers, as it seeks to ...
A new 12GB RTX 5070 laptop GPU joins NVIDIA’s lineup, using 3GB (24Gb) GDDR7 chips to address memory shortages while shipping alongside the current 8GB version.
SK hynix's new 192GB SOCAMM2 memory modules for NVIDIA's Vera Rubin platform have entered the mass production phase, ...
Memory module maker Apacer Technology reported its consolidated financial results for the first quarter of 2026, with revenue ...
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