TASKING and WITTENSTEIN high integrity systems (WHIS) have strengthened the integration between TASKING’s embedded software ...

TriLite Technologies has entered into a long-term cooperation agreement with AAC Technologies aimed at accelerating the ...

Lumus has signed a new licensing agreement with Quanta Computer to develop and manufacture a new generation of thinner and ...

SK Hynix plans to begin mass production of its next-generation HBM4E memory chips at a new facility in Indiana in 2029.

Intel has reported promising early progress on its forthcoming 14A manufacturing process, with executives claiming defect ...

GigaDevice has joined the Zephyr Project as a Silver Member, strengthening its involvement in the global open-source embedded ...

Würth Elektronik has expanded its optoelectronics product range with the launch of the WL-OCHS high-speed optocoupler, ...

Infineon Technologies has confirmed that its radiation-hardened power semiconductor devices are operating aboard NASA’s Nancy ...

Arduino has opened pre-orders for the VENTUNO Q, a new edge AI development platform powered by Qualcomm's Dragonwing IQ8 ...

Nexeon has achieved ISO 9001:2015 certification for its silicon-carbon anode materials manufacturing facility in Gunsan.

Agentrys has raised $24.5m in funding to expand its AI-powered platform aimed at automating chip development work.

Renesas Electronics has opened a new Physical AI & Robotics Lab in Beijing, strengthening its focus on next-generation ...