The EE Times Magazine explores how ambient energy harvesting, sensing, AI, and connectivity enable safer, smarter buildings.

SUSE targets sovereign AI via architectural choice, enabling enterprises to pivot between Nvidia and AMD silicon without ...

Qualcomm’s Modular buyout targets cross-chip portability across Nvidia, AMD, and its own AI hardware to break the software ...

New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat ...

OpenAI revealed first benchmarks for its Jalapeño ASIC, showing up to 1.9× perf/W gains over existing hardware for LLM ...

TLS360™ is Rochester Electronics’ lifecycle assurance program, extending select mission-critical semiconductors beyond EOL ...

Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling ...

NVMe 2.4 updates 11 base specs, adding post-quantum cryptography, advanced power monitoring, and subsystem migration for AI ...

MIT uses laser pulses and ultrafast X-rays to map microscopic heat flow in multilayer semiconductors, exposing hidden defect ...

Prepare for the EU Cyber Resilience Act's September 2026 reporting deadline; follow these seven steps to ensure compliance ...

IBM’s Amaravati deployment could accelerate India’s quantum ecosystem as startups develop processors, software, and ...

Scale-up optics will be decided by the link budget. The largest recoverable losses sit at the connector and inside the ...