Design And Reuse

ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV

On September 7, in advance of the SPIE BACUS Conference, ASML and TSMC formed a collaborative industry initiative to drive the transition to 12-inch photomasks, maximizing the value of High NA EUV ...
Design And Reuse

Imec scales NbTiN superconducting circuits to 30nm

Imec has demonstrated a three-metal-level superconducting circuit based on niobium-titanium-nitride (NbTiN), reaching a design density of 3.8 million Josephson junctions per cm². The Belgian R&D ...
Design And Reuse

SerDes, Ethernet and the silicon that connects them: Why SerDes for high-bandwidth sensors?

SerDes (Serializer/Deserializer) fits this profile. It converts wide parallel sensor data into a high-speed serial stream over a clean point-to-point path, minimizing protocol overhead and latency, ...
Design And Reuse

Arm expands AI infrastructure for the agentic era with AGI CPU and Neoverse CSS N4

Across the broader cloud ecosystem, companies are already supporting agentic AI on Arm. Google Cloud is running agent sandboxes on Axion-based GKE, Microsoft Azure is accelerating sandbox tool ...
Design And Reuse

BOS Semiconductors Joins Arm Total Design for Physical AI

BOS Semiconductors has joined Arm Total Design for Physical AI, a growing ecosystem bringing together more than 80 companies across the technology stack to accelerate the development and deployment of ...
Design And Reuse

EnSilica to open Space and Communications Semiconductor Centre of Excellence in Milan

The centre initially plans to recruit 20 specialist modem and mmWave engineers over the next six months, expanding EnSilica’s engineering presence in the European Union and enabling closer ...
Design And Reuse

Ceva and LG Electronics Partner to Accelerate UWB Adoption Across Automotive, Industrial and Consumer SoCs

The collaboration pairs Ceva-Waves™ market leading UWB baseband IP and software with UWB radio frequency (RF) technology developed by LG’s SoC Center, giving customers a silicon-ready platform for ...
Design And Reuse

Samsung Electronics and ASML expand strategic collaboration for next-generation semiconductor manufacturing

SEOUL, Korea and VELDHOVEN, the Netherlands -- Samsung Electronics and ASML today announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV ...
Design And Reuse

Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV

Specifically, Intel Foundry and ASML shared the following updates: High NA continues to be used in high-volume manufacturing production at Intel Foundry today, with more than one million wafers ...
Design And Reuse

Qualitas Semiconductor Signs MIPI IP Integrated Solution Licensing Agreement with CoAsia SEMI

SEOUL, South Korea – QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as "Qualitas") (KOSDAQ: 432720), a leading provider of high-speed interface IP solutions, announced today that it has ...
Design And Reuse

RaiderChip Unites Generative AI and Autonomous Robot Control on a single NPU

Spain -- MuJoCo is a physics simulator maintained by Google DeepMind, providing an environment for developing, training and testing robotic control systems. Robot manufacturers such as Unitree ...
Design And Reuse

CAST Introduces 100 Gbps TCP/IP Hardware Stack IP Core for High-Performance ASIC and FPGA Designs

TCPIP-100G joins CAST's broad portfolio of Internet Protocol hardware stacks and networking IP, which includes TCP/IP and UDP/IP stacks from 1G through 400G, Ethernet MACs, MACsec engines ( 1G / 10G ) ...