One of the major pure-play foundry firms in South Korea, DB HiTek, has been successful in achieving the reliability qualification… Analog Devices, Inc. and Alif Semiconductor announced that they have ...

Hungarian telecommunications and defense company 4iG Group has managed to strike up a two-pronged commercial and military deal with SpaceX. The pact was signed by SpaceX in Texas and creates an ...

The global automotive industry is undergoing one of its most significant transformations in decades, and Malaysia is preparing for its next chapter. The vehicle of the future will not be defined by ...

Everspin Technologies, Inc., the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors (Teledyne HiRel), a business unit of Teledyne Technologies Incorporated ...

Vishay Intertechnology, Inc. introduced a new series of thin film chip resistors in compact 0402 and 0603 case sizes. Built on an advanced aluminum nitride (AlN) substrate, the Vishay Sfernice CHEP ...

Hical Technologies announced the commercial launch and first customer delivery of its indigenously developed Coreless Brushless DC (BLDC) Motor for space applications, strengthening India’s ability to ...

Alps Alpine announced the launch of the SPVQK Series, a new automotive detector switch designed to support the growing adoption of 48V electrical architectures in next-generation EVs. The new product ...

A groundbreaking ceremony was held to mark the opening of the recently constructed semiconductor components plant, the Nagasaki Isahaya Plant of Kyocera, on the 1st of the month. The construction of ...

There is currently a change happening in the world of the Internet of Things (IoT) as devices at the mid-range level start switching from the usual 4G technology to ...

The Chinese semiconductor sector is witnessing an enormous boom in the packaging and testing phases of semiconductor production. The top three outsourced semiconductor assembly and test firms from ...

Cyberport’s annual flagship event, the “Digital Entertainment Leadership Forum 2026” (DELF 2026), opened at Cyberport. The opening ceremony was officiated by Prof Sun Dong, Secretary for Innovation, ...

The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing power into a smaller space in the future, industry leaders are therefore investing in new substrate ...