Cassie Sheng is an R&D process integration engineer at imec, Belgium, where she has been working since 2023. She received her ...

We trust designers to do the best they can, but know they cannot be perfect. That's why we verify. When AI gets involved, it ...

Pioneering work in developing CFET-critical modules: an improved backside contact module and a novel gate stack for threshold ...

Researchers from the Massachusetts Institute of Technology (MIT), Georgia Tech, and Penn State University embedded gallium ...

Researchers at the University of Oxford published a technical paper titled “Hardware-Managed Heterogeneous High-Bandwidth ...

Researchers from University of Alberta published a technical paper titled “PPAPlace: Differentiable Cross-Stage Objectives ...

Researchers from Purdue University published a technical paper titled “Architecting the Next Generation of Asynchronous, ...

Key Takeaways: On-die telemetry gives architects a path to replace worst-case design margin with measured silicon behavior, improving PPA without compromising resilience. As monitor density and ...

Researchers from TU Wien and Silvaco Europe published a technical paper titled “The influence of implantation conditions on ...

Thermal drift, stress, electromagnetic coupling, and verification gaps are turning optical integration into a full-system co-design problem rather than a plug-in bandwidth upgrade.

AI is supposed to be the answer to this. But for many teams, the AI conversation stalls before it starts, because it gets ...

Researchers from Georgia Institute of Technology published a technical paper titled “Thermal Tuning Overhead in Wafer-Scale ...