Plasma etching has become the cornerstone of modern semiconductor fabrication, offering unparalleled precision in the removal of material from silicon, compound semiconductors and dielectric films. By ...
After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...
The Marvell Nanofabrication Laboratory at UC Berkeley recently received a donation of a multichamber semiconductor etching system from Lam Research. The etching system will be able to serve not only ...
AlixLabs, the Lund-based semiconductor process startup developing Atomic Pitch Splitting (APS™), has completed its €15M Series A with a strategic top-up from Finnish investor Stephen Industries. The ...
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Halogen-free plasma technique achieves atomic-level etching of hafnium oxide for next-gen semiconductors
Hafnium oxide (HfO 2) has attracted attention as a promising material for ultrathin semiconductors and other microelectronic devices. The strong ionic bond between hafnium and oxygen atoms in HfO 2 ...
A technician inspects semiconductor chip packaging in Binzhou, Shandong province, on Jan 28. GUO ZHIHUA/FOR CHINA DAILY .
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