Proprietary systems have traditionally dominated the control of three and four-axis wafer handling robots for in-vacuum and in-air wafer applications. As a result, these systems can be limited in ...

With demand for chip production on an upswing, the U.S. is on track to triple its chip manufacturing capacity by 2032, according to the Semiconductor Industry Association (SIA). It follows that this ...

New pneumatic wafer gripping technology that uses a vacuum level of only 3-5 percent (30-50 millibars) compared to 80 percent for suction cup systems provides fast, reliable handling of photovoltaic ...

German automation specialist Acp systems developed an advanced robotics solution integrating image processing to handle a range of wafer sizes and tolerances within a vapor deposition process for a ...