The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...
Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...
Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
imec, a Belgium-based research and innovation hub in nanoelectronics and digital technologies, has announced “a significant milestone in silicon photonics” with the successful demonstration of ...
Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...
This paper explains the general construction and fabrication of Avago’s commercial WSP process. The advantages and disadvantages of this technology are compared candidly to more traditional microwave ...
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