SAN MATEO, Calif. — Ziptronix, a startup spun from the Research Triangle Institute (Research Triangle Park, N.C.) will introduce a new “engineered substrate” material Tuesday (Sept. 9) for use in ...
The two companies say they are cooperating on the development of low temperature wafer bonding equipment and process technologies. Silicon Genesis Corp. (SiGen) and EV Group (EVG) said today they are ...
ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...
The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet ...
At the recent IEEE Electronic Components and Technology Conference (ECTC), Imec presented a paper on a fine-pitch hybrid wafer-to-wafer bonding technology for heterogeneous integration. Imec described ...
The temporary bonding and debonding equipment uses a hybrid laser debonding solution with an industry-leading throughput of over 60 to 100 wafers per hour. It also supports wafer thinning to less than ...
CHAM, Switzerland — ESEC Group here has introduced a new 300-mm wafer handling die bonder platform, which features a unique upgrade kit that enables IC assembly operations to retool existing systems ...
The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid ...
SAN JOSE, Calif. — Austrian wafer-bonding and lithography equipment vendor EV Group, and Austrian flip-chip and die bonding equipment Datacon Technology AG have entered into a development ...
Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...
Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...
Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, ...
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