Hongyuan Green Energy says it has produced a first batch of 40 µm monocrystalline silicon wafers that support full-size and half-cut formats, with slicing completed using the company’s in-house ...
Key opportunities include the rise in high-performance computing & automotive applications, the expansion driven by 5G ...
Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...
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What Laser Cutting a Silicon Wafer REALLY Looks Like
Micromachining silicon with lasers (but no sharks)! Today we're exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser Donald Trump's approval ...
BOSTON, MA, UNITED STATES, April 16, 2025 /EINPresswire.com/ -- UniversityWafer, Inc., a leading global supplier of advanced semiconductor substrates, is proud to ...
N-type recharging polysilicon was quoted at 48-57 yuan/kg, granular polysilicon at 48-51 yuan/kg, and the polysilicon price ...
The "Thin Wafer Market Report 2026" has been added to ResearchAndMarkets.com's offering.The thin wafer market is experiencing robust growth, poised to expand from $12.57 billion in 2025 to $19.45 ...
Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...
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