ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
The semiconductor industry's push toward advanced packaging has made wafer dicing the critical gatekeeper of yield, especially for ultra-thin wafers and complex copper pillar interconnects. In 2026, ...
ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...
Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...
Lasers play a crucial role in various applications in semiconductor manufacturing, such as laser cutting and slicing. The integration of lasers enhances throughput and improves defect control, leading ...
Semiconductor devices are now universal and have a critical role in modern-day society. Semiconductors influence how we provide entertainment, interact and communicate with the world, and enable many ...
With its superb electrical characteristics, silicon is at the heart of most semiconductors. Its ability to control electrical characteristics has made it essential in modern electronics. Three ...