The fourth state of matter HF Contact or Pilot Arc Plasma gouging, too Anyone working in a fabricating shop or machining operations comes face to face with a steady stream of science and technology ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

Plasma cutters are ridiculously cheap these days, just cruise by the usual online sources or your local Harbor Freight if you’ve got any doubt about that. But “cheap” and “good” don’t always intersect ...