Vinci today announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under ...

For five years, a single idea dominated Chinmay Shrivastava's thoughts: humans didn't have enough hours in the day to build the designs of the future. An avid lover of science fiction, Chinmay ...

Hardware-in-the-loop (HiL) refers to testing a component while embedding it in one or more of its likely environments. These environments are represented virtually by computer models. The tested ...

“Addressing complex engineering challenges such as developing products that are more powerful, yet greener, lighter yet stronger requires a fully-integrated CAE solution,” said Jean-Claude Ercolanelli ...

When selecting the right central processing unit (CPU) for optimizing Ansys Mechanical structural finite element analysis (FEA) software performance, there are two major players to consider: Intel and ...