Interposer Package-on-Package (PoP) technology was developed and has been in very high-volume production over the last several years for high-end mobile application processors (APs). This is due to ...

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D ...

ROME, Jan. 14, 2025 /PRNewswire/ -- MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO, the first integrated chiplet/package ...

POET Technologies Inc. (NASDAQ:POET) is one of the best performing semiconductor stocks so far in 2026. On May 14, POET ...

DUBLIN--(BUSINESS WIRE)-- Research and Markets (http://www.researchandmarkets.com/research/8l78bn/advanced) has announced the addition of the "Advanced Packaging: 3D ...

Joint development and sale of high-speed optical modules based on the Electrical-Optical Interposer (EOI) -- a new paradigm for scale in the optical layer of AI compute SAN JOSE, Calif., May 14, 2026 ...

POET Technologies (NASDAQ:POET) shares climbed 16% on Thursday after the company announced a supply and development agreement ...

ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded ...