A high-stakes patent dispute between Hanwha Semitech and Hanmi Semiconductor over a critical piece of equipment in the HBM production process — the TCB machine — is set to unfold, with significant ...
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company defends its ...
DongShin Kwak, Chairman of Hanmi Semiconductor, announced on March 25 that he will participate as an official sponsor in the '2026 SEMICON China' exhibition, which is being held in Shanghai, China ...
HANMI Semiconductor said on the 9th it will respond preemptively to demand for hybrid bonding, which will enter full-scale mass production in 2029. A view of the HANMI Semiconductor booth at Semicon ...
I cover billionaires and startup founders in Asia. Hanmi makes the semiconductor-packaging equipment needed to assemble high-bandwidth memory chips used in AI computing. After dampened global demand ...
Hanmi Semiconductor will release its second-generation hybrid bonder, necessary for the production of next-generation high-bandwidth memory (HBM), within this year. Hanmi Semiconductor announced on ...
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