A new shipping manifest suggests that a brand-new Intel GPU is being readied for release. Hints that a new Battlemage Intel Arc B770 gaming graphics card is in development have been circulating for ...

Blackwell was recently delayed due to NVIDIA B100 and B200 GPU packaging issues that required a redesign, but production is now well underway. Recently, OpenAI received one of the first engineering ...

The news is coming from Taiwanese media outlet Ctee, reporting that the Chiayi Science Park was finalized this year and is expected to build two advanced packaging plants first. The first phase of ...

Taiwan's OSATs remain uncertain about the arrival of orders from Nvidia and AMD for processing their new GPU chips, and are expected to see their high-end packaging and testing capacities prepared for ...

The big picture: The pairing of TSMC's Arizona fab and Amkor's planned packaging plant nearby represents a gradual shift toward regionalized semiconductor production – one that may, over time, reduce ...

Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang facilities in 2015.