Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...
Fonon Well-Positioned To Capitalize on Wafer Dicing Market Growth With BlackStar Laser Dicing System
ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...
Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...
Increased tax credits for chipmakers would further incentivize domestic semiconductor production; CMS Laser is on standby to provide sophisticated silicon processing solutions powered by lasers. Today ...
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