Dow Unveils First CMP Polishing Pads from its IKONIC™ Platform; Brings New, Advanced Materials to th
PHILADELPHIA--(BUSINESS WIRE)-- Following the introduction of its IKONIC™ chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today announced its innovative Applied DuraPad ™ CMP polishing pad technology for 200mm chemical mechanical planarization (CMP) systems.
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