As the semiconductor industry moves to smaller scales, it must overcome several technical challenges. Read more here.

At its core, semiconductor manufacturing involves two main stages: front-end processes, (wafer fabrication) and back-end processes (packaging and test). Wafer fabrication consists of creating ...

This is perhaps the largest back-end semiconductor fab unit in the world. So far, 60% of work has been completed on Phase-1 with the help of a total workforce of 3,500. "We will hand over this ...

ON Semiconductor faces recovery challenges amidst rising inventory, profit margin pressure, and tariff impacts. Click here to ...

The president’s attack on the key tenet of the Biden administration’s industrial policy has set off concerns that he may claw ...

KUALA LUMPUR, Malaysia--Malaysia has entered a pact with British chip designer Arm Holdings for access to its advanced technology, as the Southeast Asian country seeks to strengthen its role in the ...

Intel Corp. has once again pushed back the expected opening for its semiconductor project in central Ohio Intel Corp. has ...

President Donald Trump said on Tuesday U.S. lawmakers should get rid of a landmark 2022 bipartisan law to give $52.7 billion in subsidies for semiconductor chips manufacturing and production and use ...

The global semiconductor sector in May 2024 registered ... Bhd and Frontken Corp Bhd. “While the back-end is expected to face challenges, we are positive on front-end prospects – driven ...

SBI aims to collaborate with SK Hynix on back-end DRAM processes and with UMC on chips for vehicles, according to the report, ...

On a semiconductor technology level there is also a school of thought that value is transferring from the front end (scaling process nodes) to the back end (advanced packaging and heterogeneous ...

President Donald Trump on Tuesday called on Congress to eliminate the CHIPS Act, which is helping to fund Intel's Ohio semiconductor factories.