WILLOW GROVE, Pa.--(BUSINESS WIRE)--April 21, 2003--Kulicke & Soffa Industries, Inc. (NASDAQ:KLIC) today announced that VLSI Research has issued its "2002 Market Share Data Report" including worldwide ...

Palomar Technologies released its 3470-II automatic wire bonder for gold or aluminum wire interconnect assembly used in military and aerospace applications. It is designed to enable deep access wedge ...

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the ...

Kulicke & Soffa has a dominant market share in the wire bonder business, and its cash-rich balance sheet makes the stock cheaper than it appears. The process of manufacturing an integrated circuit is ...

The wire bonder equipment market is experiencing steady growth due to increasing demand from various industries such as electronics, telecommunications, and automotive. Companies are investing in ...

Wire bonding, a critical yet often overlooked process in electronics manufacturing, plays an indispensable role in shaping the devices we rely on today. A programmable semi-automatic ultrasonic wire ...

DUBLIN--(BUSINESS WIRE)--The "Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), ...

Kulicke & Soffa Industries Inc. has rolled out an automatic ball bonder machine designed to maximize yield and productivity in high density matrix (HDM) and small outline packages. “The Nu-Tek ...