The Register on MSN1d
Lightmatter says it's ready to ship chip-to-chip optical highways as early as summerAI accelerators to see the light, literally Lightmatter this week unveiled a pair of silicon photonic interconnects designed ...
The silicon photonics startup has announced new products to tackle interconnect bottlenecks costing enterprises millions in ...
The computing system that Cerebras is building for DARPA will also feature āwafer scale co-packaged opticsā from Ranovus. According to Reuters, the latter technology will be used to link together ...
Lightmatter turbocharges GPU connectivity with its first photonics-based networking interconnects - SiliconANGLE ...
CPO brings optical interconnects right to the chip New architecture shifts the fiber optic connections right to the board Co-packag ...
AI compute company Cerebras Systems said it has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA) to develop a system combining their wafer scale technology with ...
View the full release here: "By combining wafer scale technology and co-packaged optics interconnects, Cerebras will deliver ...
April 01, 2025--(BUSINESS WIRE)--Lightmatter, the leader in photonic (super)computing, today announced Passageā¢ L200, the worldās ļ¬rst 3D co-packaged optics (CPO) product. Designed to ...
AI workloads are rapidly increasing, driving the need for higher bandwidth, lower latency, and more power-efficient optical interconnects. Broadcom is meeting these evolving demands with a ...
Broadcom (AVGO) announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure. These innovative ...
Lightmatter, the leader in photonic (super)computing, today announced Passageā¢ L200, the world's ?rst 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and switch silicon ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback